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Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices

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dc.contributor.author Martínez, Juan Angel
dc.contributor.author Belenguer, Angel
dc.contributor.author Esteban, Héctor
dc.date.accessioned 2019-09-26T12:00:19Z
dc.date.available 2019-09-26T12:00:19Z
dc.date.issued 2019
dc.identifier.citation IEEE Transactions on Components, Packaging and Manufacturing Technology. 2019, 1-6 es_ES
dc.identifier.issn 2156-3950
dc.identifier.issn 2156-3985
dc.identifier.uri http://hdl.handle.net/10578/21918
dc.description.abstract In this paper a novel soldering technique that improves the fabrication process of Empty Substrate Integrated Waveguide (ESIW) devices is presented. Until now, in order to fabricate an ESIW device, the tin solder paste was distributed, before assembling, on the contact surface between layers, in order to ensure a good electrical contact. This process has a low degree of repeatability (random soldering thickness and distribution of tin) and reliability (significant number of non-working prototypes due to tin overflow). In this work, we propose the mechanization of a set of plated vias just next to the metallized walls of the ESIW in the central layer. Next, in the top and bottom covers that close this ESIW, additional plated vias are drilled in the same position, so that, when the device is assembled (using screws or rivets), metallized holes can be seen passing through the whole structure from top to bottom. These holes are then used as soldering vias that can guide the tin paste straight to the point where it is needed. When the paste is dried, soldered vias ensure a very good electrical contact between layers. Besides, the fluid tin fills any small gap that appears between layers, thus providing a very good electrical contact and mechanical union. This novel soldering technique has been validated with experimental results. Several prototypes of filters centered at 13 and 35 GHz have been fabricated, proving the repeatability and reliability of the proposed soldering technique. es_ES
dc.format application/pdf es_ES
dc.language.iso en es_ES
dc.publisher EEUU: Institute of Electrical and Electronics Engineers, IEEE es_ES
dc.rights info:eu-repo/semantics/openAccess es_ES
dc.subject Empty substrate integrated waveguide es_ES
dc.subject ESIW es_ES
dc.subject Multilayer es_ES
dc.subject Fabrication es_ES
dc.title Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices es_ES
dc.type info:eu-repo/semantics/article es_ES
dc.identifier.DOI 10.1109/TCPMT.2019.2915688

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